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HDI板

分类:
PCB
作者:
2017/06/02 15:33

 

 

                                                                                    1、基本参数   


                                                                                    产品类型:HDI板


                                                                                    应用领域:工控、医疗、通讯


                                                                                    层数/板厚:10L/1.1MM


                                                                                    表面处理:沉金


                                                                                    线宽/线距:3.0/3.0MIL


                                                                                    最小孔径:0.1MM


                                                                                    技术特点:三阶叠孔,精密线路,微小孔径

 



                                                                                    2、产品优点


                                                                                    通过模块化设计,可以实现产品的多样化、特征化及差异化;


                                                                                    缩短信号的传输距离,有效减少信号阻抗、延迟、干扰带来的失真问题;


                                                                                    产品小型化,拓展产品的应用领域。

 


                                                                                     3、应用领域

 

 

 

 

                                                                                    4、核心技术


                                                                                    激光打孔技术、微盲孔填铜技术、细线路蚀刻技术、多阶HDI对位技术

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